Substrate processing system and substrate processing method
AssigneeTokyo Electron Limited
InventorsMasanori Tateyama, Syuzo Fujimaru
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AssigneeTokyo Electron Limited
InventorsMasanori Tateyama, Syuzo Fujimaru
Estimating the term…
The present invention is a substrate processing method comprising the steps of successively extracting unprocessed wafers from a cassette, successively conveying the extracted wafers to a plurality of processing units, causing the processing units to process the wafers in parallel, and returning the processed wafers to a cassette. A process completion prediction time at which processes for one lot are completed is calculated and displayed corresponding to a process recipe that has been set to a plurality of wafers for at least one lot. Corresponding to the process completion prediction time, a cassette that contains a plurality of unprocessed wafers for one lot is accepted. A cassette that contains a plurality of processed wafers for one lot is returned.
A substrate processing system, comprising:
A substrate processing method, for successively extracting unprocessed substrates from a cassette, successively conveying the extracted substrates to a plurality of processing units, causing the processing units to process the conveyed substrates, and successively returning the processed substrates to a cassette, the method comprising:
Dependencies are inferred from the claim text.