# US 6,524,758 B2 · Method of manufacture of printed wiring boards and flexible circuitry

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- Number: US 6,524,758 B2
- Document ID: US6524758B2
- Status: Granted
- Kind: B2
- Application number: 09/740,680
- Filed: 2000-12-19
- Published: 2002-03-21
- Granted: 2003-02-25
- Earliest claimed: 1999-12-20
- Assignees: Electrox Corporation
- Inventors: Dietmar C. Eberlein; Robert H. Detig
- Web page: https://patentgrep.com/patent/US6524758B2

## CPC

- H05K 3/102: {by bonding of conductive powder, i.e. metallic powder (H05K3/12 takes precedence)}
- Y10T 428/24851: Intermediate layer is discontinuous or differential
- Y10T 428/24917: including metal layer
- Y10T 428/24926: including ceramic, glass, porcelain or quartz layer
- Y10T 428/24934: including paper layer
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention relates to the fabrication process for the printed wiring boards and flex circuits. An electrostatic printing plate includes a substrate with an image receiving layer applied thereto. The image receiving layer is a toner with a metallic toner and subsequently fixed in place or is transferred to a layer. The metal toner is then fixed on this receiving surface.

## Claims

### Claim 1

A printed wiring board comprising a substrate; a photo imaginable dielectric layer coated onto the substrate, wherein at least a portion of the dielectric layer is cross-linked and wherein the cross-linked portion has a toner adhered thereto, wherein the toner comprises a member selected from the group consisting of silver and silver alloys.

### Claim 2 (depends on 1)

The printed wiring board of claim 1, further comprising an electrical ground plane layer between the substrate and the dielectric layer, wherein the ground plane layer acts as an anti-static layer.

### Claim 3 (depends on 1)

The printed wiring board of claim 1 wherein the toner has a layer of copper adhered thereto.

### Claim 4 (depends on 1)

The printed wiring board of claim 1 wherein the toner layer is between about 0.1 micron and about 100 microns thick.

### Claim 5 (depends on 1)

The printed wiring board of claim 1 wherein the toner has a layer of copper adhered thereto, and wherein the copper layer is between about 0.1 micron and about 100 microns thick.

### Claim 6 (depends on 1)

The printed wiring board of claim 1 wherein the substrate is selected from the group consisting of an electrically conductive material, a paper sheet, a metal foil, an ITO-coated polymeric film, and a mica containing laminate material.

### Claim 7 (depends on 1)

The printed wiring board of claim 1 wherein the dielectric layer comprises a photo-polymeric material.