US 6,522,762 B1 · Silicon-based sensor system

Abstract

The present invention relates solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is more flexible compared to any other system disclosed in the prior art. Electrical connections between the different elements of the microphone system are established economically and reliably via a silicon carrier using flip-chip technology. The invention uses an integrated electronic circuit chip, preferably an application specific integrated circuit (ASIC) which may be designed and manufactured separately and independent of the design and manufacture of the transducer element of the microphone. The complete sensor system can be electrically connected to an external substrate by surface mount technology with the contacts facing one side of the system that is not in conflict with the above-mentioned interface to the environment. This allows the user to apply simple and efficient surface mount techniques for the assembly of the overall system.

Claims32

Dependent claims

A sensor system comprising

a carrier member having a first surface, said first surface holding a first and a second group of contact elements,
a transducer element comprising an active member and at least one contact element, said at least one contact element being aligned with one of the contact elements of the first group so as to obtain electrical contact between the transducer element and the carrier member, and
an electronic device comprising an integrated circuit and at least one contact element, said at least one contact element being aligned with one of the contact elements of the second group so as to obtain electrical contact between the electronic device and the carrier member,
wherein at least one of the contact elements of the first group is electrically connected to at least one of the contact elements of the second group so as to obtain electrical contact between the transducer element and the electronic device;
wherein said transducer element is connected to said carrier member by a conducting sealing ring.

2 more elements

A sensor system comprising

a carrier member having a first surface, said first surface holding a first, a second and a third group of contact elements,
a first transducer element comprising an active member and at least one contact element, said at least one contact element being aligned with one of the contact elements of the first group so as to obtain electrical contact between the first transducer element and the carrier member,
a second transducer element comprising an active member and at least one contact element, said at least one contact element being aligned with one of the contact elements of the second group so as to obtain electrical contact between the second transducer element and the carrier member, and
an electronic device comprising an integrated circuit and at least one contact element, said at least one contact element being aligned with one of the contact elements of the third group so as to obtain electrical contact between the electronic device and the carrier member,
wherein at least one of the contact elements of the first group is electrically connected to at least one of the contact elements of the third group, and wherein at least one of the contact elements of the second is electrically connected to at least one of the contact elements of the third group so as to obtain electrical contact between the first transducer element and the electronic device and between the second transducer element and the electronic device.

2 more elements

Dependencies are inferred from the claim text.

Silicon-based sensor system

Life of this patent

Silicon-based sensor system

Life of this patent

Abstract

Claims32