Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same

An imaging system comprising:

• an X-Radiation source selectively generating X-Radiation which at least partially traverses an examination region;
• an X-Radiation-sensitive layer which converts received X-Radiation into photons of light;
• and
• an array of X-Radiation detector modules positioned adjacent the examination region to receive X-Radiation from the examination region from a plurality of directions, each X-Radiation detector module including:
• an array of photodetector devices, each of which has a side in optical communication with the X-Radiation-sensitive layer and each of which generates electrical signals responsive to the photons of light generated by the X-Radiation-sensitive layer;
• and
• a carrier substrate supporting each photodetector device, the carrier substrate configured to provide an electrical path from contacts on a back side of the photodetector device through the carrier substrate.

An X-Radiation detector comprising:

• an X-Radiation-sensitive surface which converts received X-Radiation into photons of light;
• a photosensitive device which has a side in optical communication with the X-Radiation-sensitive surface and which generates electrical signals responsive to the photons of light generated by the X-Radiation-sensitive surface;
• and
• a carrier substrate supporting the photosensitive device, the carrier substrate configured to provide an electrical path from contacts on a back side of the photosensitive device through the carrier substrate.

A method comprising:

• irradiating an X-Radiation-sensitive surface with X-Radiation;
• converting the X-Radiation incident upon the X-Radiation-sensitive surface into light;
• transmitting the light to a light-sensitive surface of a photodiode array to produce an electrical signal proportional to the converted light;
• and
• communicating the electrical signal to signal processing circuitry via a conductive path comprising:
• a first set of contacts disposed on a back surface of the photodiode array opposite the light-sensitive surface;
• a second set of contacts disposed on a front surface of a circuit carrying substrate, the second set of contacts aligned with and electrically coupled to the first set of contacts when the back surface of the photodiode array and the front surface of the substrate are in aligned facing relation;
• and
• a third set of contacts disposed on a back surface of the substrate opposite the front surface of the substrate.

A front-illuminated photodiode array comprising:

• a silicon substrate carrying an integrated circuit, the integrated circuit comprising an array photodiode elements in optical communication with a first surface of the silicon substrate;
• a plurality of conductive vias electrically coupled to the photodiode elements for carrying electrical signals from the photodiode elements, each via comprising (i) a channel passing through the silicon substrate from the first surface to a second surface which is disposed opposite the first surface, and (ii) a conductive path formed by near-surface impurities in the silicon substrate, the conductive path extending from the first surface to the second surface through the via;
• and
• a plurality of a metal pads formed on the second surface, the metal pads in ohmic contact with the conductive regions, the metal pads configured to facilitate electrical connection of the photodiode array with an external connector.