Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module

An electronic-component-mounted body manufacturing method, comprising the steps of:

• applying to at least either one of a circuit substrate and an electronic component a material effective in improving wettability of a binder resin of a conductive resin with respect to the circuit substrate or a component member of the electronic component;
• applying the conductive resin at a predetermined position on the circuit substrate;
• placing the electronic component at the predetermined position where the conductive resin is applied;
• and
• curing the conductive resin,
• these steps being conducted in the stated order.

An electronic-component-mounted body manufacturing method, comprising the steps of:

• applying a conductive resin at a predetermined position on a circuit substrate;
• applying to at least one of the circuit substrate, the conductive resin, and an electronic component a material effective in improving wettability of a binder resin of the conductive resin with respect to the circuit substrate or a component member of the electronic component;
• placing the electronic component at the predetermined position where the conductive resin is applied;
• and
• curing the conductive resin,
• these steps being conducted in the stated order.

An electronic-component-mounted body manufacturing method, comprising the steps of:

• applying a conductive resin at a predetermined position on a circuit substrate;
• placing an electronic component at the predetermined position where the conductive resin is applied;
• applying to at least a portion where the electronic component is placed a material effective in improving wettability of a binder resin of the conductive resin with respect to the circuit substrate or a component member of the electronic component;
• and
• curing the conductive resin,
• these steps being conducted in the stated order.