Polishing pad conditioning system

A system for conditioning rotatable polishing pads used to planarize and polish surfaces of thin film integrated circuits deposited on semiconductor wafer substrates, MEMS and/or optics, said system operably attached to an arm means capable of imparting rotational motion while simultaneously moving through an arc over said polishing pad;

• comprising:
• a polishing pad conditioning apparatus attached to a vacuum facility and means for introducing processing fluids or gasses and/or ultra-pure water to the polishing pad and imparting a low amplitude vibratory impulse to said conditioning apparatus for the purpose of dislodging and removing debris on said polishing pad;
• said conditioning apparatus comprising an outer chamber housing an inner impeller assembly;
• said outer chamber provided with a outlet port for attaching a vacuum capability;
• said impeller assembly with means for attaching a support disk, a magnetic disk or mechanical holder and an abrasive disk to the impeller blades;
• said support disk, magnetic disk or mechanical holder and abrasive disk constructed with through holes;
• said holes in support disk, magnetic disk and abrasive disk aligned one to the other to allow passage of process fluids/gasses into and/or debris from the polishing process.