Detailing tool for substrates having a self-alignment feature

A detailing tool for processing an electronic component substrate, said tool comprising:

• a supporting frame;
• a substrate positioned on said supporting frame and being movable on said supporting frame to receive and secure said substrate during processing by said tool;
• and
• a pair of cutter assemblies pivotally attached to said supporting frame for removing tails on said substrate, wherein each of said cutter assemblies includes a pair of opposed cutters that move towards each other to remove said tails from said substrate, said pair of cutter assemblies are symmetrically attached to said supporting frame with respect to an axis for indexing said substrate, whereby opposite corners on an edge of said substrate are simultaneously cut during processing.

A detailing tool for processing an electronic component substrate, said tool comprising:

• a supporting frame;
• a substrate carrier positioned on said supporting frame and being movable on said supporting frame to receive and secure said substrate during processing by said tool;
• and
• at least one cutter assembly pivotally attached to said supporting frame for removing tails on said substrate, wherein said cutter assembly includes a pair of opposed cutters that move towards each other to remove said tails from said substrate;
• wherein said cutter assembly includes a pivot member connected to said support frame wherein said cutter assembly pivots about said pivot member with respect to said supporting frame to engaged said substrate and align said substrate with said cutters.