Integrated circuit tester with high bandwidth probe assembly
AssigneeFormFactor, Inc.
InventorCharles A. Miller
Life of this patent
Estimating the term…
Abstract
Described herein is a probe card assembly providing signal paths for conveying high frequency signals between bond pads of an integrated circuit (IC) and an IC tester. The frequency response of the probe card assembly is optimized by appropriately distributing, adjusting and impedance matching resistive, capacitive and inductive impedance values along the signal paths so that the interconnect system behaves as an appropriately tuned Butterworth or Chebyshev filter.
Claims17
An apparatus for testing an integrated circuit having a node, the apparatus comprising:
- an integrated circuit tester having a terminal, for producing a test signal at the terminal;
- a probe for contacting said node;
- and
- a conductive path linking the terminal to the probe for conveying the test signal from the integrated circuit tester to the probe, wherein the node, the terminal, the probe and the conductive path form a signal path,
- wherein said node, said probe, said terminal and said conductive path have impedances sized relative to one another to substantially optimize a frequency response characteristic of said signal path.
An apparatus for testing an integrated circuit having a conductive pad, the apparatus comprising:
- an integrated circuit tester having a terminal, for producing a test signal at the terminal;
- a probe for contacting said conductive pad;
- and
- conductive means for linking said probe to said terminal for conveying the test signal between the terminal and the probe,
- wherein the conductive pad, said terminal and said conductive means form a signal path, and
- wherein said conductive pad, said terminal and said conductive means have impedances sized relative to one another to substantially optimize a frequency response characteristic of said signal path.
An apparatus for testing an integrated circuit having a conductive pad, the apparatus comprising:
- an integrated circuit tester having a terminal, for producing a test signal at the terminal;
- a probe for contacting said conductive pad;
- and
- means for linking said probe to said terminal,
- wherein the conductive pad, said terminal and said means for linking form a signal path, and
- wherein said conductive pad, said probe and said means for linking have impedances sized relative to one another to substantially optimize a frequency characteristic of said signal path, and
- wherein said means for linking comprises a printed circuit board via having a capacitance that is one of said impedances.
Dependencies are inferred from the claim text.