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US 6,500,536 B1Granted
Heat activatable adhesive composition and adhesive sheet having adhesive layer thereof
AssigneeRicoh Company, Ltd.
InventorsHiroshi Yamada, Masanaka Nagamoto, Akira Ichikawa
Life of this patent
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Abstract
A heat activatable adhesive composition including a thermoplastic resin, and a hindered phenol compound which is solid at 20° C. and which is fusible at an elevated temperature. The adhesive composition is useful as a heat activatable adhesive layer of labels or sheets including a heat-sensitive recording label.
Claims14
A heat activatable adhesive composition, comprising:
- a thermoplastic resin;
- and
- a plasticizer including a hindered phenol compound which is solid at 20° C. and which is fusible at an elevated temperature;
- wherein said thermoplastic resin and said hindered phenol compound are present in amounts of 10-70% by weight and 30-70% by weight, respectively.
1 more element
Dependencies are inferred from the claim text.