Substrate sensor

A method for making an implantable electronic device comprising:

• forming an electronic circuit within a substrate;
• forming an electrode on a surface of the substrate;
• interconnecting the electronic circuit and the electrode with a via through the substrate;
• and
• coating the substrate with an hermetic, biocompatible protective layer that covers the electronic circuit and at least a portion of the electrode.

A method for making an implantable electronic device comprising:

• forming a first electronic circuit within a first substrate;
• forming a first electrode on a surface of the first substrate;
• interconnecting the first electronic circuit and the first electrode with a first via formed through the first substrate;
• coating the first substrate with an hermetic, biocompatible protective layer that covers the first electronic circuit and at least a portion of the first electrode;
• forming a second electronic circuit within a second substrate;
• forming a second electrode on a surface of the second substrate;
• interconnecting the second electronic circuit and the second electrode with a second via formed through the second substrate;
• coating the second substrate with an hermetic, biocompatible protective layer that covers the second electronic circuit and at least a portion of the second electrode;
• and
• placing the first substrate against the second substrate so that the first electrode and the second electrode are exposed.

A method for making an implantable electronic device comprising:

• forming an electronic circuit within a substrate;
• forming an electrode on a surface of the substrate;
• interconnecting the electronic circuit and the electrode with a via that is not straight;
• and
• coating the substrate with a protective layer.

A method of making a living tissue implantable device, comprising:

• forming electrical circuitry on a first side of a semiconductor substrate;
• forming a plurality of electrodes on the semiconductor substrate, wherein at least a portion of the plurality are formed on a second side of the semiconductor substrate and wherein the second side is opposite to the first side;
• electrically interconnecting the electrodes and the electrical circuitry using a plurality of conducting stair-stepped vias that extend from the first side to the second side of the substrate;
• and
• forming a protective layer of biocompatible material over at least a portion of each of the first and second sides of the substrate such that at least a portion of the electrical circuitry and electrodes are covered by the protective layer.

A method of making a living tissue implantable device, comprising:

• forming electrical circuitry on a semiconductor substrate;
• forming a plurality of electrodes on the semiconductor substrate;
• electrically interconnecting the electrodes and the electrical circuitry using a plurality of conducting stair-stepped vias;
• and
• hermetically sealing and insulating the electrical circuitry and a portion of the electrodes by applying a protective layer of a biocompatible, hermetic, non-conducting material over at least the circuitry and a portion of the electrodes.