Heat radiation packaging structure for an electric part and packaging method thereof

A heat radiation packaging structure for at least one exothermic electric part, the packaging structure comprising:

• a housing comprising a plurality of sides and a bottom;
• a wiring board secured in the housing;
• a bus bar disposed on the wiring board, the bus bar comprising:
• a mounting portion contacting the wiring board and supporting the at least one exothermic electric part;
• at least one bent portion connected to the mounting portion and contacting a side portion of at least one exothermic electric part;
• and
• at least one thermal diffusion portion connected to the mounting portion and spaced from the wiring board;
• and
• heat conducting resin within the housing substantially sealing the wiring board, the bus bar, the at least one exothermic electric part, and substantially filling a space between the wiring board and the housing bottom.

A heat radiation packaging structure for at least one exothermic electric part, the packaging structure comprising:

• a housing comprising a plurality of sides and a bottom;
• a wiring board secured in the housing;
• a bus bar disposed on the wiring board, the bus bar comprising:
• a mounting portion contacting the wiring board and supporting the at least one exothermic electric part;
• at least one bent portion connected to the mounting portion and contacting a side portion of at least one exothermic electric part;
• and
• at least one thermal diffusion portion connected to the mounting portion and spaced from the wiring board, wherein the at least one thermal diffusion portion is substantially parallel to the wiring board;
• and
• heat conducting resin within the housing substantially sealing the wiring board, the bus bar, the at least one exothermic electric part, and substantially filling a space between the wiring board and the housing bottom.

A method of packaging at least one exothermic electric part, the method comprising:

• disposing a bus bar on a wiring board, wherein the bus bar comprises:
• a mounting portion contacting the wiring board;
• and
• at least one thermal diffusion portion connected to the mounting portion and spaced from the wiring board;
• securing the at least one exothermic electric part on the mounting portion of the bus bar;
• securing the wiring board in a housing;
• and
• substantially filling the housing with a heat conducting resin such that the heat conducting resin substantially seals the wiring board and the mounting portion and the at least one thermal diffusion portion of the bus bar.