Lead-free plain bearing and method for its manufacture
AssigneeSenju Metal Industry Co., Ltd.
InventorsIssaku Sato, Naoki Sato
Life of this patent
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Abstract
A lead-free plain bearing is formed by dispersing an alloy powder formed from 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, and Cu on a backing, such as a steel plate, and sintering. The alloy powder may further include one or more of 0.05-0.5 mass percent of molybdenum disulfide powder and 0.1-2 mass percent of graphite powder. The bearing surface may be rough finished by machining to a roughness of 0.3-1 μm Ra and then fine finished by polishing to a roughness of at most 0.1 μRa.
Claims20
A lead-free swash plate for a swash plate pump comprising a backing and a powder consisting essentially of 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, and a remainder of Cu sintered to the backing to form a bearing surface on the backing.
A lead-free swash plate for a swash plate pump comprising a backing and a powder consisting essentially of 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, at least one of 0.05-0.5 mass percent of molybdenum disulfide and 0.1-2 mass percent of graphite powder, and a remainder of Cu sintered to the backing to form a bearing surface on the backing.
Dependencies are inferred from the claim text.