Method of applying a semi-rigid film to a substrate

A method of adhesively bonding an adhesive coated semi-rigid film to a substrate comprising the steps of:

• (1) providing a semi-rigid film having a first side having a surface area and an opposite second side having a surface area wherein at least a portion of the surface area of the second side is coated with a bonding layer comprising a pressure sensitive adhesive;
• (2) providing a window comprising a substrate having a major surface and a frame wherein the frame defines an outer edge of the substrate;
• (3) providing a first alignment tool;
• (4) attaching the first alignment tool to the frame such that the first alignment tool substantially contacts the major surface of the substrate at the outer edge;
• (5) providing a second alignment tool;
• (6) attaching the second alignment tool to the frame such that the second alignment tool substantially contacts the major surface of the substrate at the outer edge;
• wherein the first and the second alignment tools are separated from one another at a distance;
• (7) optionally, applying an application fluid to the surface of the substrate or to the bonding layer of the semi-rigid film;
• (8) interposing the semi-rigid film between the first and the second alignment tools;
• (9) contacting the major surface of the substrate and the bonding layer of the film with one another such that, if present, at least a portion of the application fluid is present between the semi-rigid film and the substrate;
• (10) aligning the semi-rigid film by contacting a first side edge of the semi-rigid film with a surface of the first alignment tool and contacting a second side edge of the semi-rigid film with a surface of the second alignment tool such that the film is aligned relative to the outer edge of the substrate;
• (11) applying pressure to at least a portion of the surface area of the first side of the semi-rigid film to effectuate adhesive bonding of the film to the major surface of the substrate and, if present, forcing at least a portion of the application fluid present between the semi-rigid film and the substrate to flow out from between the semi-rigid film and the substrate at an edge;
• (12) optionally, drying the application fluid that has been forced from between the film and the substrate;
• and
• (13) optionally, removing the first and second alignment tools.