Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipment
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes at least one substrate (50) including a plurality of holes (56) and an interconnecting pattern (52) provided to one surface, part of the interconnecting pattern (52) being formed over the holes (56); at least one first semiconductor chip (10) including a plurality of electrodes (12) and provided to another surface of the substrate (50), at least one second semiconductor chip (20) including a plurality of electrodes (12) and provided to the one surface of the substrate (50); and a conductive member for electrically connecting the electrodes (12) of the first semiconductor chip (10) to the interconnecting pattern (52) and being disposed in the holes.
Claims32
A semiconductor device comprising:
- at least one substrate including a plurality of holes formed therein and an interconnecting pattern provided to one surface of the substrate, part of the interconnecting pattern being formed so as to overlap with the holes,
- at least one first semiconductor chip including a plurality of electrodes and provided to another surface of the substrate,
- at least one second semiconductor chip including a plurality of electrodes and provided to the one surface of the substrate, and
- a conductive member disposed in each of the holes for electrically connecting each of the electrodes of the first semiconductor chip to the interconnecting pattern.
A method of manufacturing a semiconductor device comprising:
- a step of mounting a first semiconductor chip over one surface of a substrate which includes a plurality of holes and an interconnecting pattern formed over another surface, part of the interconnecting pattern running over the holes;
- and
- a step of positioning a second semiconductor chip on the other surface of the substrate over which the interconnecting pattern is formed,
- wherein, in the step of mounting the first semiconductor chip, electrodes of the first semiconductor chip are electrically connected to the interconnecting pattern through a conductive member provided in each of the holes by disposing the electrodes of the first semiconductor chip to face the holes.
A manufacturing device for a semiconductor device comprising:
- first and second jigs each of which is disposed leaving a space from a surface of each of a plurality of semiconductor chips opposite to a surface facing a substrate, the semiconductor chips being mounted over both surfaces of the substrate through a resin,
- wherein each of the first and second jigs comprises a surface for applying pressure to a surface of each of the semiconductor chips opposite to the surface facing a substrate and a heating means for transmitting heat to each of the semiconductor chips, and the first and second jigs apply pressure and heat to the respective semiconductor chips positioned between the first and second jigs at the same time to make adhesive force of resin on the substrate effective so that the semiconductor chips are mounted over the substrate.
Dependencies are inferred from the claim text.