Femtosecond laser utilization methods and apparatus and method for producing nanoparticles
AssigneeBoard of Regents, University of Nebraska-Lincoln
InventorDennis R. Alexander
Life of this patent
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Abstract
The present invention teaches various femtosecond machining and drilling apparatus and processes for fabricating tools and the like from both traditional and non-traditional materials. Also described are novel tools such as scalpels, and nozzles fabricated from the apparatus and processes of the present invention. Likewise, the present invention may be utilized in both a novel propulsion system and the production of materials formed from nanometer sized particles and the like.
Claims12
A process for producing diamond nozzles, comprising boring an aperture through a diamond with femtosecond laser pulses, wherein said femtosecond laser pulses are generated at a rate less than the rate that would damage surrounding material.
A process for femtosecond laser machining, comprising:
- directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material;
- and wherein the part comprises a metal.
A process for femtosecond laser machining, comprising:
- directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material, wherein the part comprises diamond.
A process for femtosecond laser machining, comprising:
- directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material, wherein the part comprises ice.
A process for femtosecond laser machining, comprising:
- directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material, and wherein the part comprises a material selected from the group consisting of diamond, silicon, alumina, ceramic materials, and ice wherein the femtosecond laser pulses are focused down to a spot size having an intensity on the order of 1018 watts per square centimeter.
A process for femtosecond laser machining, comprising:
- directing femtosecond laser pulses at a part to be machined such that material may be selectively removed from said part to be machined, wherein said femtosecond laser pulses are focused down to a spot size sufficient to produce material removal with both linear and non-linear processes, wherein said femtosecond pulses are generated at a rate less than the rate that would damage surrounding material, wherein the femtosecond laser pulses are focused down to a spot size having an intensity on the order of 1018 watts per square centimeter.
Dependencies are inferred from the claim text.