Trap apparatus
AssigneeEbara Corporation
InventorsKuniaki Horie, Masahito Abe, Tsutomu Nakada, Yuji Araki
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AssigneeEbara Corporation
InventorsKuniaki Horie, Masahito Abe, Tsutomu Nakada, Yuji Araki
Estimating the term…
A trap apparatus is optimum for trapping a material gas discharged from a vapor deposition apparatus for depositing in a vapor phase thin films of high-dielectric or ferroelectric such as barium/strontium titanates on substrates. The trap apparatus is disposed downstream of a vacuum process chamber. The vacuum process chamber is for processing a substrate. The trap apparatus is for trapping a component having a low vapor pressure contained in a gas discharged from the vacuum process chamber. The trap apparatus includes a trap container for introducing the gas discharged from the vacuum process chamber, and a cooling device provided in the trap container for cooling the gas to a temperature equal to or lower than a condensing temperature of a gas component which is contained in the gas and easily liquidized.
A trap apparatus for use with a vacuum process chamber for processing a substrate, said trap apparatus to be disposed downstream of the vacuum process chamber and being operable to trap a component having a low vapor pressure contained in a gas discharged from the vacuum process chamber, said trap apparatus comprising:
A trap apparatus for use with a vacuum process chamber for processing a substrate, said trap apparatus to be disposed downstream of the vacuum process chamber and being operable to trap a component having a low vapor pressure contained in a gas discharged from the vacuum process chamber, said trap apparatus comprising:
A thin-film vapor deposition apparatus comprising:
A thin-film vapor deposition apparatus comprising:
Dependencies are inferred from the claim text.