Flip chip defect analysis using liquid crystal
AssigneeAdvanced Micro Devices, Inc.
InventorsDavid Harry Eppes, Michael Richard Bruce
Life of this patent
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Abstract
Defect analysis of a flip chip die having a back side opposite circuitry at a circuit side and a liquid crystal layer is enhanced using a method and system that makes possible the detection of the defect from the back side of the flip chip. According to an example embodiment of the present invention, a flip chip die having a liquid crystal layer is analyzed by detecting a liquid crystal phase change caused by heat generation at a defect in the die. By detecting the phase change associated with a defect, the defect can be located. The defect detection can be used through the back side of the die, and can be used to detect defects located near intrinsic heat sources that make conventional liquid crystal analysis difficult or even impossible.
Claims36
A method for analyzing a flip chip die, the method comprising:
- providing a flip chip die having a back side opposite circuitry at a circuit side and having a liquid crystal layer formed over a thinned region in the back side;
- generating heat in the die circuitry;
- and
- detecting a defect in the die by detecting a portion of the liquid crystal changing phase.
A system for analyzing a flip chip die having a back side opposite circuitry at a circuit side and a liquid crystal, the system comprising:
- means for providing a flip chip die having the liquid crystal formed over a thinned region in the back side;
- means for generating heat in the die circuitry;
- and
- means for testing the die, the testing means adapted to detect a defect as a portion of liquid crystal changing phase.
A system for analyzing a flip chip die, the flip chip die having a back side opposite circuitry at a circuit side and a liquid crystal, the system comprising:
- an arrangement adapted to provide a flip chip die having the liquid crystal formed over a thinned region in the back side;
- an heat generation arrangement adapted to generate heat in the die circuitry;
- and
- a testing arrangement adapted to detect a defect in the die as a portion of the liquid crystal changing phase.
Dependencies are inferred from the claim text.