Semiconductor memory device with reduced current consumption in data hold mode
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorHideto Hidaka
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorHideto Hidaka
Estimating the term…
A power supply circuit generating a power supply voltage for refresh-related circuitry and a power supply circuit for column-related/peripheral control circuitry are controlled by a power supply control circuit to be put in different power supply voltage supplying states in a self refresh mode. In the self refresh mode, only self refresh-related circuitry receives a power supply voltage to perform refresh operation. A reduced current consumption can be achieved in the self refresh mode while fast access operation is not deteriorated.
A semiconductor device comprising:
Dependencies are inferred from the claim text.
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Details of stores covered by group G11C11/00: power supply arrangements , e.g. power down, chip selection or deselection, layout of wirings or…
Power supply arrangements , e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels: detection…
Forming cells needing refreshing or charge regeneration, i.e. dynamic cells: management or control of the refreshing or charge-regeneration cycles
For memory cells of the field-effect type: power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage…
Term ended 23 Feb 2020 (estimated)
1. Field of the Invention
The present invention relates generally to semiconductor devices, and in particular to configurations for reducing the current consumed in a refresh mode for holding data, such as a sleep mode or a power down mode, without causing an erroneous operation in a semiconductor memory device requiring refreshing of storage data. More specifically, the present invention relates to a configuration for reducing the current consumed in a refresh mode by a logic merged memory with a logic and a dynamic random access memory integrated on a single semiconductor chip.
2. Description of the Background Art
FIG. 1 schematically shows an entire configuration of a semiconductor device according to the present invention.
FIG. 2 schematically shows a configuration of a semiconductor device according to a first embodiment of the present invention.
FIG. 3 schematically shows a configuration of a power supply circuit for the column-related/peripheral control circuitry shown in FIG. 2.
First Embodiment
FIG. 1 schematically shows an entire configuration of a semiconductor device with the present invention applied thereto. In FIG. 1, a semiconductor device 10 according to the present invention includes a DRAM macro 11 including 1 transistor-1 capacitor type dynamic memory cells, and a logic circuit 12 transmitting and receiving data to and from DRAM macro 11. DRAM macro 11 and logic circuit 12 are integrated on a single semiconductor clip.
DRAM macro 11 includes a DRAM cell array 13 having dynamic memory cells, and DRAM peripheral circuitry 14 basically for selecting a memory cell included in DRAM cell array 13 and for reading/writing data.