Back to results
US 6,487,085 B1Granted
High-frequency module and method of manufacturing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsJunichi Kimura, Ryouji Mitsuzono, Terumoto Akatsuka
Life of this patent
Estimating the term…
Abstract
A miniaturized high-frequency module includes an integrated circuit and chip capacitors electrically connected therewith within a recess in a substrate and to make a crystal oscillator and the substrate virtually equal in size. Thereby, a miniaturized high-frequency module can be obtained.
Claims6
A high-frequency module comprising:
- a substrate having a recess and made of an insulator;
- an integrated circuit flip-chip-mounted on the bottom surface of said recess, wherein said integrated circuit flip-chip-mounted has bump contacts;
- a filter electrically connected with said integrated circuit, said filter disposed on said substrate so as to cover said recess;
- and
- a chip capacitor electrically connected with said integrated circuit, said filter disposed on said substrate so as to cover said recess,
- wherein an area of said integrated circuit is smaller than that of said filter, and wherein said filter and said substrate are virtually equal in size.
3 more elements
A high-frequency module comprising:
- a substrate having a recess and made of an insulator;
- an integrated circuit flip-chip-mounted on the bottom surface of said recess;
- a filter electrically connected with said integrated circuit, said filter disposed on said substrate so as to cover said recess;
- and
- a chip capacitor electrically connected with said integrated circuit, said filter disposed on said substrate so as to cover said recess,
- wherein said filter and said substrate are virtually equal in size;
- said high-frequency module including a temperature-compensated oscillator comprising:
- a filter provided by a crystal oscillator;
- and
- an integrated circuit comprising:
- an oscillation circuit;
- an output terminal connected to said oscillation circuit;
- a temperature compensating circuit;
- a frequency control circuit;
- and
- a stabilized power supply circuit connected with a chip capacitor disposed outside said integrated circuit.
13 more elements
A high-frequency module comprising:
- a substrate made of an insulator;
- a recess formed in said substrate;
- a PPL integrated circuit flip-chip-mounted to the bottom surface of said recess;
- and
- a voltage-controlled oscillator electrically connected with said PPL integrated circuit, said voltage-controlled oscillator disposed on said substrate so as to cover said recess;
- and
- a low-pass filter made up of chip components electrically connected with said PPL integrated circuit, said low-pass filter contained within said recess;
- wherein an area of said PPL integrated circuit is smaller than that of said low-pass filter and wherein said filter and said substrate are virtually equal in size.
5 more elements
Dependencies are inferred from the claim text.