Printed circuit board component packaging

A printed circuit board comprising:

• a processor board including a left side and a right side;
• a first HUB-chip conductive portion on the left side of the processor board;
• a second HUB-chip conductive portion on the right side of the processor board;
• and
• a first processor-chip conductive portion on the left side of the processor board, the first processor-chip conductive portion being electrically coupled to the first HUB-chip conductive portion;
• a second processor-chip conductive portion on the right side of the processor board, the first processor-chip conductive portion being electrically coupled to the second HUB-chip conductive portion, wherein the first and second processor-chip conductive portions are positioned on a lower surface of the processor board, and the first and second HUB-conductive portions are positioned on an upper surface of the processor board.

A method of fabricating circuit boards comprising:

• forming a first HUB-chip conductive portion and a first processor-chip conductive portion on a left side of a processor board;
• forming a second HUB-chip conductive portion and a second processor-chip conductive portion on a right side of a processor board;
• and
• separating the left side of the processor board from the right side of the processor board to form a pair of circuit boards, wherein the first HUB-chip conductive portion and the first processor-chip conductive portion are formed on the left side of the processor board and the second HUB-chip conductive portion and the second processor-chip conductive portion are formed on the right side of the processor board such that the left side of the processor board is symmetric to the right side of the processor board thereby forming a pair of identical circuit boards when the left side of the processor board is separated from the right side of the processor board.