Cooling system for electronic device
AssigneeFurukawa Electric Co., Ltd.
InventorsNaoki Kimura, Jun Niekawa, Hiroaki Maekawa
Life of this patent
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Abstract
A cooling system for an electronic device including a heat generating component within a case, wherein the heat generating component is installed on a bottom plate of the case, the bottom plate has a ventilating hole for air passage formed therein, and a foot portion installed outer surface of the case for maintaining a prescribed vertically opened space below the lower surface of the case.
Claims9
A cooling system for an electronic device having a heat generating component within a case, the system comprising:
- a bottom plate of said case in thermal communication with said heat generating component;
- wherein said bottom plate comprises a heat transfer material and functions as a heat dissipating device;
- wherein said bottom plate comprises a ventilating hole for air passage;
- and
- a foot portion installed on an outer surface of said case for maintaining a prescribed vertically opened space below a lower surface of said case.
A cooling system for an electronic device having a heat generating component within a case, the system comprising:
- a side plate of said case in thermal communication with said heat generating component;
- wherein said side plate comprises a heat transfer material and functions as a heat dissipating device;
- wherein said side plate comprises a ventilating hole for air passage;
- and
- an air guiding plate for guiding an outside air into said ventilating hole when located at a first position, and wherein said guiding plate is configured to cover said ventilating hole when said air guiding plate is located at a second position.
Dependencies are inferred from the claim text.