Device under test board and testing method
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsRyoichi Takagi, Masahiko Hyozo
Life of this patent
Estimating the term…
Abstract
A device under test (DUT) board for testing is electrically connected to a solder ball of a package. A contactor of the board is directly attached to the solder ball. Thus, there is little influence by bouncing of a power source and ground, even when an LSI under test is operated at high speed and low voltage, and malfunctions are rare.
Claims16
A device under test (DUT) board for testing a device having a package including an electrode, by being electrically connected with the electrode of the package, the DUT board comprising:
- a contactor for direct contact with an electrode of a package upon mounting of the electrode on the DUT board, wherein said contactor is an elastic metallic plate having a U-shaped slit, a first part defined by the U-shaped slit, and a second part that is planar, the first part being bent with respect to the second part;
- a guiding mechanism for maintaining a position of the electrode of the package;
- and
- a pushing mechanism for pressing the electrode of the package against said contactor.
A device under test (DUT) board for testing a device having a package including an electrode, by being electrically connected with the electrode of the package, the DUT board comprising:
- a contactor for direct contact with an electrode of a package upon mounting of the electrode on the DUT board, wherein said contactor is a strip of an elastic metallic plate, the metallic plate having a slit in a longitudinal direction proximate a center of the strip, said metallic plate is bent in opposite directions adjacent the slit to form a V shape, in cross section, for receiving and contacting the electrode;
- and
- a slide movable away from and toward the contactor for opening and closing the V shape of said contactor.
A device under test (DUT) board for testing a device having a package including an electrode, by being electrically connected with the electrode of the package, the DUT board comprising:
- a contactor for direct contact with an electrode of a package upon mounting of the electrode on the DUT board, wherein said contactor is a strip of an elastic metallic plate, the metallic plate having a slit in a longitudinal direction proximate a center of the strip, said metallic plate is bent in opposite directions adjacent the slit to form a V shape, in cross section, for receiving and contacting the electrode;
- a guiding mechanism for maintaining a position of the electrode of the package;
- and
- a pushing mechanism for pressing the electrode of the package against said contactor.
A device under test (DUT) board for testing a device having a package including an electrode by being electrically connected with the electrode of the package, the DUT board comprising:
- a contactor having a patterned principal surface for connection to the electrode of the package upon mounting of the package on the DUT board;
- a guiding mechanism for maintaining a position of the electrode of the package;
- a pushing mechanism for pressing the electrode of the package against said contactor;
- and
- an electrically conductive rubber located between the electrode of the package and said contactor.
Dependencies are inferred from the claim text.