Heat dissipation module for a BGA IC
AssigneeWalsin Advanced Electronics LTD
InventorsWen-Chun Liu, Yi-Hsiang Pan, Kuo-Yuan Lee
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Abstract
An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
Claims19
A heat dissipation module for a BGA (Ball Grid Array) IC (Integrated Circuit) device encapsulated along with a chip and a substrate inside glue where electrical connections are made between the chip and the substrate in a connection area, the heat dissipation module comprising:
- an annular base, whose inner rim covers the connection area for the chip and the substrate;
- multiple supports, which extend from the inner rim of the annular base upwards;
- a top plate, which is supported by the supports and is higher than the highest point of the electrical connections between the chip and the substrate;
- and
- at least one protruding ring, which is formed upward on top of the top plate to separate from the glue to expose to the air without the need for a second machining to remove a part of the glue on the top plate.
Dependencies are inferred from the claim text.