Circuit device with bonding strength improved and method of manufacturing the same

A method of manufacturing a circuit device with a ball grid array (BGA) package structure, comprising:

• mounting at least a flip chip on an interposer substrate via solder bumps which connect a plurality of first connecting pads and a plurality of second connecting pads to produce a mounted assembly, wherein said plurality of first connecting pads are provided on an upper surface of said interposer substrate and said plurality of second connecting pads are provided on a lower surface of said flip chip;
• setting said mounted assembly in a cavity formed by molds such that an upper surface of said flip chip and said lower surface of said interposer substrate are in contact with walls of said cavity;
• forming a unitary mold resin by injecting a resin into said cavity such that said resin fills a space between said lower surface of said flip chip and said upper surface of said interposer substrate and peripheral portions of said flip chip on said upper surface of said interposer substrate;
• and
• directly coupling a heat spreader to said upper surface of said flip chip with a metal paste and coupling said heat spreader to upper surfaces of said peripheral portions.

A method of manufacturing a circuit device with a ball grid array (BGA) package structure, comprising:

• mounting at least a flip chip on an interposer substrate via solder bumps which connect a plurality of first connecting pads and a plurality of second connecting pads, wherein said plurality of first connecting pads are provided on an upper surface of said interposer substrate and said plurality of second connecting pads are provided on a lower surface of said flip chip;
• directly coupling a heat spreader to said upper surface of said flip chip with a metal paste to produce a mounted assembly;
• setting said mounted assembly in a cavity formed by molds such that an upper surface of said flip chip and said lower surface of said interposer substrate are in contact with walls of said cavity;
• and
• forming a unitary mold resin by injecting a resin into said cavity such that said resin fills a space between said lower surface of said flip chip and said upper surface of said interposer substrate and peripheral portions of said flip chip on said upper surface of said interposer substrate.