Semiconductor light emitting element formed on a clear or translucent substrate
AssigneeLuminary Logic Ltd.
InventorsMichelle Jillian Fuwausa, Kevie Dowhower
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Abstract
This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.
Claims18
A semiconductor illumination device for providing illuminating an object, comprising:
- a unitary substrate adapted to extend over the object;
- a plurality of conductors deposited on the substrate;
- and
- a light emitting element formed as a packageless semiconductor junction attached to said conductors and oriented on said substrate to direct radiation toward the object.
A semiconductor illumination device comprising:
- a transparent substrate;
- a plurality of conductors deposited on said substrate;
- a plurality of light emitting elements attached to said substrate and connected to said conductors to receive excitation signals, said light emitting elements being formed of packageless semiconductor junction.
A semiconductor illumination device for illuminating an object comprising:
- a substrate arranged to disposed over said object;
- a plurality of conductors deposited on said substrate;
- and
- a light emitting element attached to said substrate and connected to said conductors to receive excitation signals, said light emitting element being formed of a packageless semiconductor junction.
Dependencies are inferred from the claim text.