US 6,486,551 B1 · Wired board and method of producing the same

Abstract

A wired board comprises a plurality of bonding pads for connection to connecting terminals of an electronic part, and a plurality of external connection terminals for connection to connecting terminals of an external circuit board such as a motherboard. Each of the bonding pads has a metallized layer, and further has a Ni—B-plated layer, a Ni—P-plated layer and a Au-plated layer which are formed in this order on the metallized layer. The Au-plated layer has the thickness ranging from 1.2 to 3.5 μm. Each of the external connection terminals has a metallized layer, and further has a Ni—B-plated layer and a Au-plated layer which are formed in this order on the metallized layer of each of the external connection terminals. The Au-plated layer of each of the external connection terminals has the thickness ranging from 0.01 to 1 μm. A method of producing the wired board is also provided.

Claims2

Dependent claims

A wired board comprising:

a substrate;
a plurality of bonding pads formed on said substrate for connection to connecting terminals of an electronic part;
a plurality of external connection terminals formed on said substrate for connection to connecting terminals of an external circuit board;
each of said bonding pads having a metallized layer formed on said substrate, and further having a Ni—B-plated layer, a Ni—P-plated layer and a Au-plated layer which are formed in this order on said metallized layer, said Au-plated layer having the thickness ranging from 1.2 to 3.5 μm;
and
each of said external connection terminals having a metallized layer formed on said substrate, and further having a Ni—B-plated layer and a Au-plated layer which are formed in this order on said metallized layer of each of said external connection terminals, said Au-plated layer of each of said external connection terminals having the thickness ranging from 0.01 to 1 μm.

3 more elements

Dependencies are inferred from the claim text.

Wired board and method of producing the same

Life of this patent

Wired board and method of producing the same

Life of this patent

Abstract

Claims2