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US 6,486,545 B1Granted
Pre-drilled ball grid array package
AssigneeAmkor Technology, Inc.
InventorsThomas P. Glenn, Steven Webster, Roy Dale Hollaway
Life of this patent
Estimating the term…
Abstract
A ball grid array (BAG) package includes a substrate having a central aperture. Traces are coupled to a lower surface of the substrate. First ends of the traces support an electronic component in the central aperture. Interconnection balls are formed on second ends of the traces. The interconnection balls extend from the second ends of the traces, through the substrate, and protrude above a second surface of the substrate.
Claims34
A package comprising:
- a substrate comprising a central aperture;
- electrically conductive traces coupled to a first surface of said substrate;
- an electronic component flip chip mounted to first ends of said traces by electrically conductive bumps, said traces supporting said electronic component in said central aperture;
- and
- electrically conductive interconnection balls formed on second ends of said traces, said interconnection balls extending from said second ends of said traces, through said substrate, and protruding above a second surface of said substrate.
2 more elements
A stacked package comprising:
- a first substrate comprising a first central aperture;
- electrically conductive first traces coupled to a first surface of said first substrate, said first traces comprising pinholes;
- a first electronic component flip chip mounted to first ends of said first traces by electrically conductive first bumps, said first traces supporting said first electronic component in said first central aperture;
- a second substrate comprising a second central aperture;
- electrically conductive second traces coupled to a first surface of said second substrate;
- a second electronic component flip chip mounted to first ends of said second traces by electrically conductive second bumps, said second traces supporting said second electronic component in said second central aperture;
- and
- interconnection rods extending from said second traces, through said second substrate, through said pinholes, through said first substrate, and to a height above a second surface of said first substrate.
5 more elements
A stacked package comprising:
- a first substrate comprising a first central aperture;
- an electrically conductive first trace coupled to a first surface of said first substrate, said first trace comprising a pinhole;
- a first electronic component supported in said first central aperture by said first trace;
- a second substrate comprising a second central aperture;
- an electrically conductive second trace coupled to a first surface of said second substrate;
- a second electronic component supported in said second central aperture by said second trace;
- and
- an interconnection rod extending from said second trace, through said second substrate, through said pinhole, through said first substrate, and to a height above a second surface of said first substrate.
5 more elements
A stacked package comprising:
- a means for supporting a first electronic component in a first central aperture of a first substrate;
- a means for supporting a second electronic component in a second central aperture of a second substrate;
- and
- a means for supporting said first substrate above said second substrate, said means for supporting forming electrical interconnections with said means for supporting a first electronic component and said means for supporting a second electronic component.
1 more element
Dependencies are inferred from the claim text.