Semiconductor-supporting devices, processes for the production of the same, joined bodies and processes for the production of the same
AssigneeNGK Insulators, Ltd.
InventorsTsuneaki Ohashi, Tomoyuki Fujii
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Abstract
A semiconductor-supporting device comprising a substrate made of an insulating material, a conductive member buried in the substrate, and a terminal connected to the conductive member and made of an electrically conductive metallic matrix-ceramic composite body.
Claims4
A semiconductor-supporting device comprising a substrate made of an insulating material, a conductive member buried in the substrate, a terminal connected to the conductive member and made of a metal or a conductive ceramic material, a joining member interposed between the terminal and the substrate, joined to the terminal and the substrate and made of a metallic matrix-ceramic composite body comprising at least one ceramic selected from the group consisting of granular alumina and granular aluminum nitride.
Dependencies are inferred from the claim text.