Semiconductor package with warpage resistant substrate
AssigneeAmkor Technology, Inc.
InventorMarkus K. Liebhard
Life of this patent
Estimating the term…
Abstract
A semiconductor package and a method for fabricating a semiconductor package are disclosed. The semiconductor package includes semiconductor chip attached to a circuit board that includes at least one lateral slot formed through the circuit board. Provision of the slot reduces stresses in the circuit board that are manifested by warpage. The semiconductor chip may be positioned in a central aperture of the circuit board and held therein by hardened encapsulant material.
Claims23
A semiconductor package comprising:
- a circuit board having circuit patterns on at least a first surface of the circuit board and a central aperture through the circuit board;
- a semiconductor chip within the central aperture and electrically connected to the circuit patterns of said circuit board, wherein the circuit board includes at least one slot through the circuit board and an outer peripheral wall, and at least one said slot extends inward from the outer peripheral wall;
- a hardened encapsulant material in said central aperture and covering the semiconductor chip and at least a portion of the circuit board.
A circuit board strip for making a plurality of semiconductor packages comprising:
- an array of circuit boards each containing conductive circuit patterns on at least one surface thereof, and a central aperture adapted for placement of a semiconductor chip therein,
- wherein each circuit board of the array includes at least one slot through the circuit board extending inward from an outer peripheral wall of the circuit board, said at least one slot being located so that the semiconductor package made using the circuit board includes said at least one slot.
A semiconductor package comprising:
- a substrate having metalizations on at least a first surface of the substrate, a central aperture through the substrate, and a slot extending inwardly toward the central aperture from a periphery of the substrate;
- a semiconductor chip within the central aperture and electrically connected to the metalizations of said substrate;
- and
- a hardened encapsulant material in said central aperture and covering the semiconductor chip and at least a portion of the substrate.
A semiconductor package:
- a circuit board having conductive patterns on at least a first surface of the circuit board and a central aperture through the circuit board;
- a semiconductor chip within a central aperture of the circuit board and electrically connected to the circuit patterns of said circuit board, wherein the circuit board includes at least one linear slot through the circuit board;
- and
- a hardened encapsulant material covering the semiconductor chip and at least a portion of the circuit board.
Dependencies are inferred from the claim text.