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US 6,486,414 B2Granted
Through-hole structure and printed circuit board including the through-hole structure
AssigneeInternational Business Machines Corporation
InventorsKaoru Kobayashi, Hiroyuki Mori, Kimihiro Yamanaka
Life of this patent
Estimating the term…
Abstract
The present invention provides a through-hole structure for connecting a connector to a printed circuit board, the through-hole structure comprising a signal through-hole having a conductive layer therein for supplying a signal to the printed circuit board, power through-holes having a conductive layer therein for supplying power to the printed circuit board, and dielectric constant adjusting portions formed among the signal through-hole and the power through-holes. Moreover, the present invention provides a printed circuit board having the above-described through-hole structure formed therein.
Claims30
A through-hole structure comprising:
- a dielectric substrate having a connector portion therein, the connector portion having a dielectric constant;
- a first through-hole positioned in said connector portion of said dielectric substrate, said first through-hole including a conductive layer therein for supplying a signal to said through-hole structure;
- a second through-hole positioned in said connector portion of said dielectric substrate, spaced relative to said first through-hole, said second through-hole including a conductive layer therein for supplying electrical power to said through-hole structure;
- and
- at least one dielectric constant adjusting nonconductive portion positioned in said connector portion of said dielectric substrate, spaced relative to said first and second through-holes to adjust said dielectric constant of said connector portion of said dielectric substrate.
2 more elements
A through-hole structure comprising:
- a dielectric substrate having a connector portion therein, the connector portion having a dielectric constant;
- a first through-hole positioned in said connector portion of said dielectric substrate, said first through-hole including a conductive layer therein for supplying a signal to said through-hole structure;
- a second through-hole positioned in said connector portion of said dielectric substrate, spaced relative to said first through-hole, said second through-hole including a conductive layer therein for supplying electrical power to said through-hole structure;
- and
- at least one dielectric constant adjusting nonconductive portion positioned in said connector portion of said dielectric substrate between said first and second through-holes to adjust said dielectric constant of said connector portion of said dielectric substrate.
2 more elements
A through-hole structure comprising:
- a dielectric substrate having a connector portion therein, the connector portion having a dielectric constant;
- a first through-hole positioned in said connector portion of said dielectric substrate, said first through-hole including a conductive layer therein for supplying a signal to said through-hole structure;
- a second through-hole positioned in said connector portion of said dielectric substrate, spaced relative to said first through-hole, said second through-hole including a conductive layer therein for supplying electrical power to said through-hole structure;
- and
- at least one dielectric constant adjusting nonconductive through-hole positioned in said connector portion of said dielectric substrate, spaced relative to said first and second through-holes to adjust said dielectric constant of said connector portion of said dielectric substrate.
2 more elements
A through-hole structure comprising:
- a dielectric substrate having a connector portion therein, said connector portion having a dielectric constant;
- a first through-hole positioned in said connector portion of said dielectric substrate, said first through-hole including a conductive layer therein for supplying a signal to said through-hole structure;
- a second through-hole positioned in said connector portion of said dielectric substrate, spaced relative to said first through-hole, said second through-hole including a conductive layer therein for supplying electrical power to said through-hole structure;
- and
- at least one dielectric constant adjusting nonconductive through-hole positioned in said connector portion of said dielectric substrate between said first and second through-holes to adjust said dielectric constant of said connector portion of said dielectric substrate.
2 more elements
A through-hole structure comprising:
- a dielectric substrate having a connector portion therein, said connector portion having a dielectric constant;
- a first through-hole positioned in said connector portion of said dielectric substrate, said first through-hole including a conductive layer therein for supplying a signal to said through-hole structure;
- a plurality of second through-holes positioned in said connector portion of said dielectric substrate, spaced relative to said first through-hole, each of said plurality of second through-holes including a conductive layer therein for supplying electrical power to said through-hole structure;
- and
- a plurality of dielectric constant adjusting nonconductive portions centrosymmetrically positioned around said first though hole in said connector portion of said dielectric substrate relative to said plurality of said second through-holes to adjust said dielectric constant of said connector portion of said dielectric substrate.
2 more elements
A through-hole structure comprising:
- a dielectric substrate having a connector portion therein, said connector portion having a dielectric constant;
- a first through-hole positioned in said connector portion of said dielectric substrate, said first through-hole including a conductive layer therein for supplying a signal to said through-hole structure;
- a plurality of second through-holes positioned in said connector portion of said dielectric substrate, spaced relative to said first through-hole, each said plurality of second through-holes including a conductive layer therein for supplying electrical power to said through-hole structure;
- and
- a plurality of dielectric constant adjusting nonconductive portions asymmetrically positioned around said first though hole in said connector portion of said dielectric substrate relative to said plurality of said second through-holes to adjust said dielectric constant of said connector portion of said dielectric substrate.
2 more elements
A printed circuit board comprising:
- a dielectric substrate having a connector portion therein;
- a through-hole structure in said connector portion for connecting a connector to said printed circuit board;
- a first through-hole positioned in said through-hole structure, said first through-hole including a conductive layer therein for supplying a signal to said printed circuit board;
- a second through-hole positioned in said through-hole structure, spaced relative to said first through-hole, said second through-hole including a conductive layer therein for supplying electrical power to said printed circuit board;
- and
- at least one dielectric constant adjusting nonconductive portion positioned in said through-hole structure, spaced relative to said first and second through-holes to substantially prevent impedance mismatch between said printed circuit board and said connector.
3 more elements
A printed circuit board comprising:
- a dielectric substrate having a connector portion therein;
- a through-hole structure in said connector portion for connecting a connector to said printed circuit board;
- a first through-hole positioned in said through-hole structure, said first through-hole including a conductive layer therein for supplying a signal to said printed circuit board;
- a second through-hole positioned in said through-hole structure, spaced relative to said first through-hole, said second through-hole including a conductive layer therein for supplying electrical power to said printed circuit board;
- and
- at least one dielectric constant adjusting nonconductive portion positioned in said through-hole structure between said first and second through-holes to substantially prevent impedance mismatch between said printed circuit board and said connector.
3 more elements
A printed circuit board comprising:
- a dielectric substrate having a connector portion therein;
- a through-hole structure in said connector portion for connecting a connector to said printed circuit board;
- a first through-hole positioned in said through-hole structure, said first through-hole including a conductive layer therein for supplying a signal to said printed circuit board;
- a second through-hole positioned in said through-hole structure, spaced relative to said first through-hole, said second through-hole including a conductive layer therein for supplying electrical power to said printed circuit board;
- and
- at least one dielectric constant adjusting nonconductive through-hole positioned in said through-hole structure, spaced relative to said first and second through-holes to substantially prevent impedance mismatch between said printed circuit board and said connector.
3 more elements
A printed circuit board comprising:
- a dielectric substrate having a connector portion therein;
- a through-hole structure in said connector portion for connecting a connector to said printed circuit board;
- a first through-hole positioned in said through-hole structure, said first through-hole including a conductive layer therein for supplying a signal to said printed circuit board;
- a second through-hole positioned in said through-hole structure, spaced relative to said first through-hole, said second through-hole including a conductive layer therein for supplying electrical power to said printed circuit board;
- and
- at least one dielectric constant adjusting nonconductive through-hole positioned in said through-hole structure, spaced between said first and second through-holes to substantially prevent impedance mismatch between said printed circuit board and said connector.
3 more elements
A printed circuit board comprising:
- a dielectric substrate having a connector portion therein;
- a through-hole structure in said connector portion for connecting a connector to said printed circuit board;
- a first through-hole positioned in said through-hole structure, said first through-hole including a conductive layer therein for supplying a signal to said printed circuit board;
- a plurality of second through-holes positioned in said through-hole structure, spaced relative to said first through-hole, each of said plurality of second through-holes including a conductive layer therein for supplying electrical power to said printed circuit board;
- and
- a plurality of dielectric constant adjusting nonconductive portions centrosymmetrically positioned around said first through-hole in said through-hole structure relative to said plurality of second through-holes to substantially prevent impedance mismatch between said printed circuit board and said connector.
3 more elements
A printed circuit board comprising:
- a dielectric substrate having a connector portion therein;
- a through-hole structure in said connector portion for connecting a connector to said printed circuit board;
- a first through-hole positioned in said through-hole structure, said first through-hole including a conductive layer therein for supplying a signal to said printed circuit board;
- a plurality of second through-holes positioned in said through-hole structure, spaced relative to said first through-hole, each of said plurality of second through-holes including a conductive layer therein for supplying electrical power to said printed circuit board;
- and
- a plurality of dielectric constant adjusting nonconductive portions asymmetrically positioned around said first through-hole in said through-hole structure, spaced relative to said plurality of second through-holes to substantially prevent impedance mismatch between said printed circuit board and said connector.
3 more elements
Dependencies are inferred from the claim text.