Substrate coated with a conductive layer and manufacturing method thereof
AssigneeEbara Corporation
InventorNaoaki Ogure
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Abstract
A substrate is coated with a conductive layer, which comprises a conductive layer of bonded ultrafine metal particles formed on the top surface thereof. The ultra fine metal particles have a diameter of 1-20 nm, and the substrate is of a flexible high polymer material. Since the conductive layer is formed by bonded layer of the ultrafine metal particles, an extremely thin layer having high conductivity can be formed. This structure enables the formation of a flexible printed circuit board with high-density interconnects or a transparent conductive film provided with both transparency and conductivity. Conventional vacuum equipments and complicated processes are not necessary for forming the conductive layer on the substrate.
Claims13
A substrate coated with a conductive layer, comprising;
- a substrate having a top surface;
- and
- a conductive layer of bonded ultrafine metal particles formed on the top surface of the substrate;
- wherein said ultrafine metal particles comprise a thermal decomposition product of an organic complex or a metallic salt comprising a silver complex or a silver salt.
Dependencies are inferred from the claim text.