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US 6,486,412 B2Granted
Wiring board, method for producing same, display device, and electronic device
AssigneeSeiko Epson Corporation
InventorHiroki Kato
Life of this patent
Estimating the term…
Abstract
In a wiring board having a mounting region on which an integrated circuit having a plurality of terminals is mounted, and having a plurality of substrate-side wiring lines to be connected to the integrated circuit formed thereon, a conductor pattern is formed to extend in a substantially radial form from a prescribed point in the mounting region to reach two or more of the substrate-side wiring lines to be grounded.
Claims22
A wiring board comprising:
- a base member including a film member permeable to moisture having a mounting region where an integrated circuit is mounted, said integrated circuit having a plurality of terminals;
- a surface of said integrated circuit where said plurality of terminals are formed;
- a plurality of wiring lines formed on said base member so as to extend from outside the mounting region to within a perimeter of said mounting region;
- a conductor pattern formed inside said mounting region of said base member, facing said surface of said integrated circuit, and having a shape extending in a substantially radial form toward said plurality of wiring lines;
- an anisotropic conductive film disposed between said base member and said surface of said integrated circuit, located in at least said mounting region;
- and
- a plurality of conductive particles dispersed in said anisotropic conductive film, electrically connecting said plurality of terminals and said plurality of wring lines.
4 more elements
A wiring board comprising:
- a base member including a film member permeable to moisture, having a mounting region where an integrated circuit is mounted;
- said integrated circuit having a surface where a plurality of terminals are formed;
- a plurality of wiring lines formed on said base member;
- a conductor pattern formed inside said mounting region facing said surface of said integrated circuit, and having a shape extending in a substantially radial form from a prescribed point proximate a center of said mounting region;
- an anisotropic conductive film disposed between said base member and said surface of said integrated circuit, located in at least said mounting region;
- and
- a plurality of conductive particles dispersed in said anisotropic conductive film, electrically connecting said plurality of terminals and said plurality of wring lines.
4 more elements
A display device comprising:
- a display panel having an electro-optical substance held between a first electrode and a second electrode facing each other;
- a base member connected to said display panel;
- an integrated circuit which has a plurality of terminals, and which is mounted on a mounting region of said base member;
- a surface of said integrated circuit, where said plurality of terminals are formed;
- a plurality of wiring lines formed on said base member;
- and
- a conductor pattern formed inside said mounting region of said base member where said integrated circuit is mounted, facing said surface of said integrated circuit, electrically connected to said plurality of wiring lines and having a shape extending in a substantially radial form toward said plurality of wiring lines;
- an anisotropic conductive film disposed between said base member and said surface of said integrated circuit, located in at least said mounting region;
- and
- a plurality of conductive particles dispersed in said anisotropic conductive film, electrically connecting said plurality of terminals and said plurality of wring lines.
7 more elements
A display device comprising:
- a display panel having an electro-optical substance held between a first electrode and a second electrode facing each other;
- a driving IC electrically connected to said display panel and which is provided on said display panel;
- a base member connected to said display panel;
- an integrated circuit which has a plurality of terminals and which is mounted on a mounting region of said base member and which is electrically connected to said driving IC;
- a surface of said integrated circuit, where said plurality of terminals are formed;
- a plurality of wiring lines formed on said base member;
- a conductor pattern formed inside said mounting region of said base member on which said integrated circuit is mounted, facing said surface of said integrated circuit, electrically connected to said plurality of wiring lines and having a shape extending in a substantially radial form toward said plurality of wiring lines;
- an anisotropic conductive film disposed between said base member and said surface of said integrated circuit, located in at least said mounting region;
- and
- a plurality of conductive particles dispersed in said anisotropic conductive film, electrically connecting said plurality of terminals and said plurality of wring lines.
7 more elements
A method for producing a wiring board including a base member having an integrated circuit mounted on a mounting region and a plurality of wiring lines which are formed on said base member and which are connected to a plurality of terminals of said integrated circuit, the method comprising:
- a step of forming a conductor pattern having a shape extending in a substantially radial form toward said plurality of wiring lines on said mounting region of said base member on which said integrated circuit is mounted, and
- a step of mounting said integrated circuit on said mounting region.
Dependencies are inferred from the claim text.