Flexible wiring substrate
AssigneeSeiko Epson Corporation
InventorYukitoshi Sako
Life of this patent
Estimating the term…
Abstract
A first conductive pattern having a pitch of not more than a predetermined pitch is formed on a main surface of a thin flexible substrate. In addition, a second conductive pattern having a pitch of not less than the predetermined pitch is formed on a rear surface of the substrate. A through hole is formed so as to be enclosed by respective parts of the areas, mainly, land areas at edge portions, of the conductive patterns and has openings at both front and rear sides of the substrate. In the through hole, a high viscosity conductive material formed by screen printing from the main surface side of the flexible substrate and a low viscosity conductive material formed by screen printing from the rear surface side contact each other. Accordingly, a via connection structure is formed.
Claims9
A flexible wiring substrate, comprising:
- a flexible substrate having a first conductive pattern provided with a pitch of not more than a first pitch formed on a main surface of the flexible substrate and a second conductive pattern provided with a pitch of not less than the first pitch formed on a rear surface of the flexible substrate;
- and
- a via connection structure having a first conductive material printed from a main surface side and a second conductive material printed from a rear surface side contacting each other in a penetrating hole formed in the substrate so as to be enclosed by respective parts of areas of the first conductive pattern and the second conductive pattern, the second material being composed of a material having a lower viscosity in comparison to the first conductive material.
A flexible wiring substrate, comprising:
- a flexible substrate having a first conductive pattern provided with a pitch of not more than a first pitch formed on a main surface of the flexible substrate and a second conductive pattern provided with a pitch of more than the first pitch formed on a rear surface of the flexible substrate;
- and
- a via connection structure having a first conductive material printed from a main surface side and a second conductive material printed from a rear surface side contacting each other in a penetrating hole formed in the substrate so as to be enclosed by respective parts of areas of the first conductive pattern and the second conductive pattern, the first conductive material having a first diameter and extending to a part of an area of the first conductive pattern, and the second conductive material having a second diameter larger than the first diameter and extending to a part of an area of the second conductive pattern;
- the second conductive material being formed of a material having a lower viscosity in comparison to the first conductive material.
A flexible wiring substrate, comprising:
- a flexible substrate having a first conductive pattern provided with a pitch of not more than a first pitch formed on a main surface of the flexible substrate and a second conductive pattern provided with a pitch of more than the first pitch formed on a rear surface of the flexible substrate;
- and
- a via connection structure having a first conductive material printed from a main surface side and a second conductive material printed from a rear surface side contacting each other in a penetrating hole formed in the substrate so as to be enclosed by respective parts of areas of the first conductive pattern and the second conductive pattern, the first conductive material having a first diameter and extending to a part of an area of the first conductive pattern, and the second conductive material having a second diameter larger than the first diameter and extending to a part of an area of the second conductive pattern;
- inner diameters at the respective parts of the areas of the first conductive pattern and the second conductive pattern being larger than a diameter of the penetrating hole in the substrate.
A flexible wiring substrate, comprising:
- a flexible substrate having a first conductive pattern provided with a pitch of not more than a first pitch formed on a main surface of the flexible substrate and a second conductive pattern provided with a pitch of not less than the first pitch formed on a rear surface of the flexible substrate;
- and
- a via connection structure having a first conductive material printed from a main surface side and a second conductive material printed from a rear surface side contacting each other in a penetrating hole formed in the substrate so as to be enclosed by respective parts of areas of the first conductive pattern and the second conductive pattern, the second conductive material forming the second conductive pattern, the second conductive material being composed of a material having a lower viscosity in comparison to the first conductive material.
Dependencies are inferred from the claim text.