Radiation curable hot melt adhesive
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorsZiyi Hu, Charles W. Paul
Life of this patent
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Abstract
Provides high vinyl, radial multi-block styrene-butadiene-styrene-containing hot melt adhesive compositions that are radiation-curable to yield pressure-sensitive adhesive films with improved peel adhesion and cohesive strength, especially at elevated temperatures. These pressure-sensitive adhesive tapes are ideally suited for tape and label applications requiring good cohesive strength at elevated temperatures and yet are readily removed from painted or other surfaces leaving no adhesive residue.
Claims13
A radiation-curable hot melt pressure sensitive adhesive, comprising:
- (a) from about 5% to about 40% by weight of at least one high vinyl, radial multiblock styrene-butadiene block copolymer which has a relatively broad molecular weight distribution;
- (b) from about 30% to about 80% by weight of at least one solid tackifier;
- (c) from about 0.05% to about 5% by weight of at least one photoinitiator;
- (d) from about 0% to about 15% by weight of at least-one high vinyl, linear styrene-butadiene-styrene or multi-block styrene-butadiene copolymer;
- (e) from about 0% to about 15% by weight of at least one high diblock conventional low vinyl styrene-butadiene-styrene or styrene-isoprene-styrene;
- (f) from about 0% to about 40% by weight of at least one oil or liquid tackifier;
- and
- (g) from about 0% to about 3% by weight of at least one antioxidant.
A radiation-curable hot melt pressure sensitive adhesive, comprising:
- (a) about 20% to about 30% by weight radial multi-block styrene butadiene block copolymer having about 60% by weight vinyl and about 26% by weight styrene;
- (b) about 45% to about 60% by weight of a hydrogenated tackifier resin;
- (c) about 0.5% to about 1.5% by weight of a photoinitiator;
- (d) about 10% to about 20% by weight of a white mineral oil;
- (e) about 0% to about 0.5% by weight of an acrylic antioxidant;
- (f) about 0% to about 0.5% by weight of a thioester antioxidant;
- (g) about 0% to about 0.5% by weight of a hindered phenol antioxidant;
- and
- (h) about 0% to about 10% by weight of a diblock copolymer.
A radiation-curable hot melt pressure sensitive adhesive comprising at least one high vinyl, radial multiblock styrene-butadiene block copolymer;
- at least one high diblock conventional low vinyl styrene-butadiene-styrene or styrene-isoprene-styrene which has a diblock content of 30% or greater;
- at least one solid tackifier;
- and at least one photoinitiator.
Dependencies are inferred from the claim text.