Spherical shaped semiconductor integrated circuit
AssigneeBall Semiconductor, Inc.
InventorAkira Ishikawa
Life of this patent
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Abstract
A spherical shaped semiconductor integrated circuit (“ball”) and a system and method for manufacturing same. The ball replaces the function of the flat, conventional chip. The physical dimensions of the ball allow it to adapt to many different manufacturing processes which otherwise could not be used. Furthermore, the assembly and mounting of the ball may facilitates efficient use of the semiconductor as well as circuit board space.
Claims12
A method for processing a sequence of spherical shaped semiconductor devices comprising the steps of performing a first processing operation on the devices while the devices sequentially move through a processing chamber without physical contact with the chamber, the sequence of the devices being maintained through the processing chamber, transferring each device through a pipe in the same sequence after the first processing operation has been performed on that device, and performing a second processing operation on the transferred devices in the same sequence.
A method for processing a sequence of three-dimensional devices comprising the steps of allowing the devices to move from an inlet in a continuous process, both of a first chamber, processing the devices while moving there through, transferring each device to a second chamber, and performing a second processing operation on the transferred devices.
A method for processing a sequence of three-dimensional devices comprising the steps of providing the three-dimensional devices to a first chamber in a continuous process, providing a processing fluid to the first chamber so that the devices are processed, transferring each device to a second chamber, and performing a second processing operation on the transferred devices.
Dependencies are inferred from the claim text.