US 6,486,053 B2 · Semiconductor device and fabricating method therefor

Abstract

The present invention relates to a semiconductor device and a fabricating method therefor. According to the semiconductor device of the present invention, a phased layer of under bump metallurgy (UBM) is formed by repeatedly depositing chrome and copper layers with sputtering equipment in which chrome and copper targets are installed in singular or plural chambers. The chrome and copper layers of the phased layer are deposited in the structure of the same, thin multi-layers possible for mutual diffusion, wherein the chrome layers gradually get thinner and the copper layers gradually get thicker. As a consequence, reliability in the phased layer of the present invention is achieved with increase in the speed of depositing UBM to reduce the time and cost for all the fabricating processes of the semiconductor device.

Claims5

Dependent claims

A method for fabricating a semiconductor device comprising the steps of:

forming a conductive electrode pad on a substrate;
forming a passivation layer with an opening to expose the electrode pad in the substrate;
and
sequentially depositing a first metal layer on the electrode pad and the passivation layer, a phased layer as an intermediate layer and a third metal layer to form under bump metallurgy (UBM), wherein the phased layer is respectively formed with the first and a second metal layer of the same material and the third and a fourth metal layers of the same material, and the second metal layer gradually gets thinner from the first metal layer toward the third metal layer while the fourth metal layer gradually gets thicker from the first metal layer toward the third metal layer.

1 more element

Dependencies are inferred from the claim text.

Semiconductor device and fabricating method therefor

Life of this patent

Semiconductor device and fabricating method therefor

Life of this patent

Abstract

Claims5