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US 6,486,052 B1Granted
Package having terminated plating layer and its manufacturing method
AssigneeNEC Corporation
InventorRyoji Sato
Life of this patent
Estimating the term…
Abstract
In a package for mounting a semiconductor device and a bump, an interposer substrate has a first surface for mounting the semiconductor device. A wiring layer capable of being connected to the semiconductor device, a terminal connected to the wiring layer for mounting the bump, and a plating layer are formed on a second surface of the interposer substrate. The plating layer is connected to one of the terminal and the wiring layer. The plating layer is terminated within the interposer substrate.
Claims9
A package for mounting a semiconductor device and a bump, comprising:
- an interposer substrate having a first surface for mounting said semiconductor device;
- a wiring layer formed on a second surface of said interposer substrate being connected to said semiconductor device;
- a terminal, formed on the second surface of said interposer substrate and connected to said wiring layer, for mounting said bump;
- a plating layer, formed on the second surface of said interposer substrate and connected to said terminal,
- said plating layer being terminated within said interposer substrate at a location to reduce parasitic capacitance of said plating layer,
- wherein a throughhole is provided in said interposer substrate, said plating layer being electrically terminated at said throughhole.
3 more elements
A package for mounting a semiconductor device, comprising:
- an interposer substrate having first and second surfaces;
- an adhesive layer directly connecting said semiconductor device to said first surface;
- a wiring layer connected to said second surface;
- a contact bump connecting said wiring layer to said semiconductor device through said interposer substrate and said adhesive layer;
- a terminal having a first end connected to said wiring layer and being connected to said second surface;
- a first plating layer, connected to said second surface and to a second end of said terminal;
- and
- a throughhole through said first plating layer, said interposer substrate and said adhesive layer.
5 more elements
Dependencies are inferred from the claim text.