Method and apparatus for process control of alignment in dual damascene processes
AssigneeAdvanced Micro Devices, Inc.
InventorsJohn C. Miethke, Gregory B. Starnes
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Abstract
The present invention is directed to a method of performing alignment during processing of a semiconductor device. The method is comprised of: performing alignment registration on a plurality of layers on said semiconductor device; measuring misregistration of said alignment registration in relation to a predetermined standard alignment key; and generating an offset for a subsequent process layer on said semiconductor using said measure misregistration.
Claims7
A method of performing alignment during a dual damascene processing of a semiconductor device, comprising:
- performing alignment registration on a plurality of layers on said semiconductor device in response to said dual damascene processing;
- measuring misregistration of said alignment registration in relation to a predetermined standard alignment key;
- and
- generating an offset for a subsequent process layer on said semiconductor using said measured misregistration to create a connection for a via related to said dual damascene process.
An apparatus for performing alignment during processing of a semiconductor device, comprising:
- means for performing alignment registration on a plurality of layers on said semiconductor device in response to said dual damascene processing;
- means for measuring misregistration of said alignment registration in relation to a predetermined standard alignment key;
- and
- means for generating an offset for a subsequent process layer on said semiconductor using said measured misregistration to create a connection for a via related to said dual damascene process.
Dependencies are inferred from the claim text.