Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection

Abstract

A thermal conductive sheet including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes are formed in the thermal conductive sheet and a conductive resin composition is filled in the through-holes. The thermal conductive sheet and a semiconductor chip are overlapped to match positions of the through-holes formed in the thermal conductive sheet with those of the electrodes formed on the semiconductor chip. The thermal conductive sheet and the semiconductor chip are compressed while being heated and the thermal conductive sheet is cured and integrated with the semiconductor chip. An external lead electrode is formed on the thermal conductive sheet at a side opposite to the surface where the semiconductor chip is overlapped, and that is connected with the conductive resin composition. According to the above-mentioned configuration, a semiconductor package that is not required to be sealed by resin, and is excellent in reliability, air-tightness and thermal conductivity can be realized.

Dependencies are inferred from the claim text.