Fabricating method of semiconductor device

A fabricating method of a semiconductor device, comprising the steps of:

• (a) forming a non-fluid resin layer with a predetermined thickness on a surface of a wiring substrate, the surface of the wiring substrate having a connecting terminal and a wiring layer, the non-fluid resin layer not being formed on the connecting terminal;
• (b) forming a first bump on the connecting terminal of the wiring substrate;
• (c) preparing a semiconductor element having an electrode terminal on a main surface thereof;
• (d) forming a second bump on the electrode terminal of the semiconductor element;
• (e) mounting the semiconductor element with a face down on a surface of the wiring substrate, the surface of the wiring substrate having the non-fluid resin layer, and contacting the second bump of the semiconductor element with the first bump of the wiring substrate;
• and
• (f) heating and melting the first bump and the second bump to connect the electrode terminal of the semiconductor element and the connecting terminal of the wiring substrate, and contacting the semiconductor element to the non-fluid resin layer.

A fabricating method of a semiconductor device, comprising the steps of:

• (a) forming a non-fluid resin layer with a predetermined thickness on a surface of a wiring substrate, the surface of the wiring substrate having a connecting terminal and a wiring layer, the non-fluid resin layer not being formed on the connecting terminal;
• (b) preparing a semiconductor element having an electrode terminal on a main surface thereof;
• (c) forming bumps on at least one of the electrode terminal of the semiconductor element and the connecting terminal of the wiring substrate;
• (d) mounting the semiconductor element face down on a surface of the wiring substrate, the surface of the wiring substrate having the non-fluid resin layer;
• (e) contacting the electrode terminal and the connecting terminal through the bumps;
• and
• (f) heating and melting the bumps to connect the electrode terminal of the semiconductor element and the connecting terminal of the wiring substrate, and contacting the semiconductor element to the non-fluid resin layer;
• wherein step (a) has the steps of:
• coating photo-setting liquid resin on the wiring substrate;
• and
• exposing and developing the liquid resin layer with a mask having a predetermined pattern, and forming a photo-setting layer.