Semiconductor package and fabricating method thereof
AssigneeHyundai Electronics Industries Co., Ltd.
InventorIn-Soo Kang
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Abstract
The present invention, as embodied and broadly described, the present invention includes a semiconductor chip, a chip pad in a first area of the semiconductor chip, a stress-easing layer formed in a second area of the semiconductor chip, a conductive wire connecting the chip pad to the stress-easing layer. And an electrical conductor on the conductive wire over the stress-easing layer. And, the present invention includes the steps of forming a chip pad on a first area of a semiconductor chip, forming a stress-easing layer on a second area of the semiconductor chip, forming a conductive wire connecting the chip pad to the stress-easing layer, and forming a electrical conductor on the conductive wire over the stress-easing layer.
Claims7
A method of fabricating a semiconductor package, comprising the steps of:
- forming a chip pad on a first area of a semiconductor chip;
- forming a stress-easing layer on a second area of the semiconductor chip;
- forming a conductive wire connecting the chip pad to the stress-easing layer;
- and
- forming an electrical conductor on the conductive wire over the stress-easing layer.
Dependencies are inferred from the claim text.