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AssigneeSiemens Aktiengesellschaft
InventorsLuc Boone, Hubert De Steur, Marcel Heermann, Jozef Van Puymbroeck
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The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (0) and the bottom part (U) of the substrate (S1).
A method for producing wiring arrangements with electrically conductive cross connections between conductive structures on a top side and on an underside of a substrate, said method comprising the steps of molding a substrate from electrically insulating plastic, said substrate having at least one wall surface being an end wall having a contour selected from an oblique contour, a roof-shaped contour and a convex contour, said molding being selected from injection molding, transfer molding and compression molding;
A wiring arrangement on a substrate with electrically conductive cross connections between conductor structures on a top side of the substrate and on an underside of the substrate, said substrate having at least one end with a contour selected from an oblique contour, a roof-shaped contour and a convex contour, and the cross connections being in the form of conductor tracks arranged in the region of the above-mentioned contour of at least one end of the substrate.
Dependencies are inferred from the claim text.