Method for masking a hole in a substrate during plating
AssigneeInternational Business Machines Corporation
InventorsLawrence Robert Blumberg, Norman A. Card, Jr., Richard Allen Day, Stephen J. Fuerniss, John Joseph Konrad, Jeffrey McKeveny, Timothy L. Wells
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Abstract
Through-holes in a substrate are masked during plating of the substrate by substantially filling the through-holes with a liquid material, followed by applying a photoimageable material to an external surface of the substrate, forming a predetermined pattern in the photoimageable material, circuitizing the predetermined pattern and then removing both the photoimageable material and the liquid material from the through-holes.
Claims13
A method for masking a hole in a substrate during plating of the substrate which comprises:
- providing a substrate with first and second external surfaces and having at least one hole extending substantially through the substrate;
- substantially filling the at least one hole with a liquid material to facilitate tenting over of the at least one hole with subsequently to be applied photoimageable material;
- applying a photoimageable material to at least one external surface of the substrate;
- forming a predetermined pattern in the photoimageable material;
- circuitizing the predetermined pattern;
- removing the photoimageable material from the at least one external surface;
- and
- removing the liquid material from the at least one hole.
Dependencies are inferred from the claim text.