Laminated radiation member, power semiconductor apparatus, and method for producing the same

A laminated radiation member comprising:

• a radiation plate;
• an insulation substrate bonded to an upper surface of said radiation plate;
• and
• an electrode provided on an upper surface of said insulation substrate;
• wherein said radiation plate and said insulation substrate are directly bonded via a metal base composite material layer in which ceramic particles are dispersed and which is interposed between said radiation plate and said insulation substrate;
• and
• wherein said metal base composite material layer is produced by reacting said ceramic dispersion particles previously surface treated so as to assure wettability with a hard solder or a metal, with a hard solder or a metal which is molten and penetrated between said ceramic dispersion particles, said reaction being carried out in a space between said radiation plate, the bonding surface of which may be previously surface treated so as to assure wettability with the hard solder or the metal, and said insulation substrate, the bonding surface of which may be previously surface treated so as to assure wettability with the hard solder or the metal.