Chemical vapor deposition system

A method of operating a chemical vapor deposition system to deposit a film on a surface of a substrate, the method comprising steps of:

• (a) providing a muffle with at least one chamber with an injector assembly adapted to inject a chemical vapor into the chamber to process the substrates, a belt adapted to move the substrates to be processed through the muffle into the chamber, and an exhaust system adapted to exhaust spent chemical vapor from the muffle, at least one of the belt, the muffle or the exhaust system having an oxidation-resistant coating comprising a nickel aluminide layer so that formation of deposits thereon and generation of particles is reduced;
• (b) placing the substrate on the belt;
• (c) moving the belt to transport the substrate into a chemical vapor deposition chamber;
• (d) injecting chemical vapors into the chemical vapor deposition chamber;
• and
• (e) reacting the chemical vapors in the chemical vapor deposition chamber to deposit the film on the surface of the substrate.