Method of applying an adhesive material to lead fingers of a lead frame

A method of applying an adhesive material on lead fingers of a lead frame, comprising:

• providing at least one lead frame having at least one lead finger, the at least one lead finger including a bottom surface and at least one other surface above the bottom surface;
• providing an adhesive reservoir having an adhesive material therein;
• providing a coating stencil proximate an outlet of the adhesive reservoir, the coating stencil having a substantially flat and horizontal top surface, and having a plurality of apertures formed therethrough, each aperture appropriately sized and arranged for applying a portion of the adhesive material on only a specific portion of an underside of at least one lead finger;
• inducing the adhesive material in the reservoir to extrude through at least one aperture of the plurality of apertures to form at least one meniscus including an exposed surface of the adhesive material to have a desired profile and to extend to a desired height above the coating stencil;
• supplying adhesive material to the adhesive reservoir;
• controlling the height of the exposed surface of the at least one meniscus of the adhesive material above the coating stencil;
• providing said at least one lead frame over the exposed surface of the at least one meniscus with said bottom surface of said at least one lead finger substantially parallel to a major portion of the exposed surface of said at least one meniscus;
• and
• contacting at least a portion of the bottom surface of the at least one lead finger with the exposed surface of the at least one meniscus of the adhesive material to deposit a portion of the adhesive material on only a specific portion of the bottom surface of the at least one lead finger without depositing an appreciable amount of adhesive material above the bottom surface of the at least one lead finger.