Thin film forming method

A thin film forming method, comprising:

• a first step of setting an atmosphere for a base as a thin film forming target to a first vacuum degree, and introducing a gas of an organometallic compound and an oxidizing gas onto a surface of the base heated to a first temperature while the gas of the organometallic compound and the oxidizing gas are being introduced, to form a plurality of crystal nuclei, which are made of an oxide of a metal constituting the organometallic compound, on the surface of the base;
• a second step of setting the atmosphere for the base to a second vacuum degree, and introducing the gas of the organometallic compound and the oxidizing gas onto the surface of the base heated to a second temperature, to form a film made of the oxide of the metal on the surface of the base;
• the first step comprising setting the first temperature to a temperature at which the oxide of the metal is formed by crystal growth on surfaces of different materials, and forming the plurality of crystal nuclei at a high density so that a crystal grain which is formed by growing a crystal nucleus comes into contact with a crystal grain growing from an adjacent crystal nucleus, and
• the second step comprising setting the second temperature to less than a temperature at which the oxide of the metal is formed by crystal growth on the surfaces of the different materials.

A thin film forming method, comprising:

• a first step of setting an atmosphere for a base as a thin film forming target to a first vacuum degree, and introducing a gas of an organometallic compound and an oxidizing gas onto a surface of the base heated to a first temperature while the gas of the organometallic compound and the oxidizing gas are being introduced, to form a plurality of crystal nuclei, which are made of an oxide of a metal constituting the organometallic compound, on the surface of the base;
• a second step of setting the atmosphere for the base to a second vacuum degree, and introducing the gas of the organometallic compound and the oxidizing gas onto the surface of the bass heated to a second temperature, to form a film made of an oxide of the metal on the surface of the base;
• the first step comprising setting the first temperature to a temperature at which the oxide of the metal is formed by crystal growth on surfaces of different materials, and forming the plurality of crystal nuclei at a high density so that a crystal grain which is formed by growing a crystal nucleus comes into contact with a crystal grain growing from an adjacent crystal nucleus;
• the second step comprising setting the second temperature to less than a temperature at which the oxide of the metal is formed by crystal growth on the surfaces of the different materials;
• and
• the second step being performed when gas supply is stopped for a period of time after the first step.

A thin film forming method, comprising:

• a preprocessing step of exposing a surface of a base as a thin film forming target to a plasma;
• a first step of setting an atmosphere for the base to a first vacuum degree, and introducing a gas of an organometallic compound and an oxidizing gas onto the surface of the base heated to a first temperature, to form a plurality of crystal nuclei, which are made of an oxide of a metal constituting the organometallic compound, on the surface of the base;
• a second step of setting the atmosphere for the base to a second vacuum degree, and introducing the gas of the organometallic compound and the oxidizing gas onto the surface of the base heated to a second temperature, to form a film made of an oxide of the metal on the surface of the base;
• the first step comprising setting the first vacuum degree to a vacuum degree at which the oxide of the metal is formed by crystal growth on the surface of the base subjected to the pre-process, and forming the plurality of crystal nuclei at a high density so that a crystal grain which is formed by growing a crystal nucleus comes into contact with a crystal grain growing from an adjacent crystal nucleus;
• and
• the second step comprising setting the second temperature to less than a temperature at which the oxide of the metal is formed by crystal growth on surfaces of different materials.

A thin film forming method, comprising:

• a first step of setting an atmosphere for a base as a thin film forming target to a first vacuum degree, and introducing a gas of an organometallic compound, an oxidizing gas, and an inert gas onto a surface of the base heated to a first temperature while the gas of the organometallic compound, the oxidizing gas, and the inert gas are being introduced, to form a plurality of crystal nuclei, which are made of an oxide of a metal constituting the organometallic compound, on the surface of the base;
• a second step of setting the atmosphere for the base to a second vacuum degree, and introducing the gas of the organometallic compound and the oxidizing gas onto the surface of the base heated to a second temperature, to form a film made of the oxide of the metal on the surface of the base,
• the first step comprising setting a partial pressure of a gas of the organometallic compound to a pressure at which the oxide of the metal is formed by crystal growth on surfaces of different materials at the first temperature, and forming the plurality of crystal nuclei at a high density so that a crystal grain which is formed by growing a crystal nucleus comes into contact with a crystal grain growing from an adjacent crystal nucleus;
• and
• the second step comprising setting the second temperature to less than a temperature at which the oxide of the metal is formed by crystal growth on the surfaces of the different materials.

A thin film forming method, comprising:

• a first step of setting an atmosphere for a base as a thin film forming target to a first vacuum degree, and introducing a gas of an organometallic compound, an oxidizing gas, and an inert gas onto a surface of the base heated to a first temperature while the gas of the organometallic compound, the oxidizing gas, and the inert gas are being introduced, to form a plurality of crystal nuclei, which are made of an oxide of a metal constituting the organometallic compound, on the surface of the base;
• a second step of setting the atmosphere for the base to a second vacuum degree, and introducing the gas of the organometallic compound and the oxidizing gas onto the surface of the base heated to a second temperature, to form a film made of the oxide of the metal on the surface of the base;
• the first step comprising setting a partial pressure of a gas of the organometallic compound to a pressure at which the oxide of the metal is formed by crystal growth on surfaces of different materials at the first temperature, and forming the plurality of crystal nuclei at a high density so that a crystal grain which is formed by growing a crystal nucleus comes into contact with a crystal grain growing from an adjacent crystal nucleus;
• the second step comprising setting the second temperature to less than a temperature at which the oxide of the metal is formed by crystal growth on the surfaces of the different materials, and
• the second step being performed when gas supply is stopped for a period of time after the first step.

A thin film forming method, comprising:

• a first step of setting an atmosphere for a base as a thin film forming target to a first vacuum degree, and introducing a first gas comprising an organometallic compound and an oxidizing gas onto a surface of the base heated to a first temperature while the first gas is being introduced, to form a plurality of crystal nuclei, which are made of an oxide of a first metal constituting the organometallic compound, on the surface of the base;
• a second step of setting the atmosphere for the base to a second vacuum degree, and introducing a second gas comprising an organometallic compound and an oxidizing gas onto the surface of the base heated to a second temperature, to form a film made of an oxide of a second metal constituting the organometallic compound on the surface of the base;
• the first step comprising setting the first temperature to a temperature at which the oxide of the first metal is formed by crystal growth on surfaces of different materials, and forming the plurality of crystal nuclei at a high density so that a crystal grain which is formed by growing a crystal nucleus comes into contact with a crystal grain growing from an adjacent crystal nucleus, and
• the second step comprising setting the second temperature to less than a temperature at which the oxide of the second metal is formed by crystal growth on the surfaces of the different materials.

A thin film forming method, comprising:

• a first step of setting an atmosphere for a base as a thin film forming target to a first vacuum degree, and introducing a first gas comprising an organometallic compound, an oxidizing gas, and an inert gas onto a surface of the base heated to a first temperature while the first gas is being introduced, to form a plurality of crystal nuclei, which are made of an oxide of a first metal constituting the organometallic compound, on the surface of the base;
• a second step of setting the atmosphere for the base to a second vacuum degree, and introducing a second gas comprising the organometallic compound and the oxidizing gas onto the surface of the base heated to a second temperature, to form a film made of an oxide of a second metal on the surface of the base,
• the first step comprising setting a partial pressure of a gas of the organometallic compound to a pressure at which the oxide of the first metal is formed by crystal growth on surfaces of different materials at the first temperature, and forming the plurality of crystal nuclei at a high density so that a crystal grain which is formed by growing a crystal nucleus comes into contact with a crystal grain growing from an adjacent crystal nucleus;
• and
• the second step comprising setting the second temperature to less than a temperature at which the oxide of the second metal is formed by crystal growth on the surfaces of the different materials.