Loading patent…
AssigneeSaint-Gobain Abrasives Technology Company
InventorsRichard M. Andrews, Sergej-Tomislav Buljan, Srinivasan Ramanath, Earl G. Geary
Estimating the term…
A straight, thin, monolithic abrasive wheel formed of hard and rigid abrasive grains and a sintered bond including a metal component and an active metal component exhibits superior stiffness. The metal component can be selected from among many sinterable metal compositions. The active metal is a metal capable of reacting to form a bond with the abrasive grains at sintering conditions and is present in an amount effective to integrate the grains and sintered bond into a grain-reinforced composite. A diamond abrasive, copper/tin/titanium sintered bond abrasive wheel is preferred. Such a wheel is useful for abrading operations in the electronics industry, such as cutting silicon wafers and alumina-titanium carbide pucks. The stiffness of the novel abrasive wheels is higher than conventional straight monolithic wheels and therefore improved cutting precision and less chipping can be attained without increase of wheel thickness and concomitant increased kerf loss.
A method of cutting a work piece comprising the step of contacting the work piece with an abrasive wheel comprising a straight, grain-reinforced abrasive disk having a uniform width in the range of about 20-2,500 μm, consisting essentially of about 2.5-50 vol. % abrasive grains and a complemental amount of a bond comprising a metal component and an active metal which forms a chemical bond with the abrasive grains on sintering, the active metal and abrasive grains being present in an amount effective to produce a grain-reinforced abrasive disk having an elastic modulus value of at least 10% higher than the elastic modulus value of an abrasive disk of same composition but free of active metal.
Dependencies are inferred from the claim text.