Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
AssigneeMicron Technology, Inc.
InventorsGundu M. Sabde, Scott Meikle
Life of this patent
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Abstract
A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a fixed abrasive polishing pad having metal abrasive elements selected to be a compound of metal in the substrate. Alternatively, the metal abrasive elements can include a refractory metal where the substrate includes a refractory metal. Where the substrate includes two metals, the abrasive elements can be selected to planarize the first metal at a rate that is less than approximately twice the rate at which it planarizes the second metal. A single fixed abrasive polishing pad and a single planarizing liquid can be used to planarize both metals.
Claims21
A combination of a metal-containing substrate, a fixed abrasive polishing pad, and a planarizing liquid comprising:
- a microelectronic substrate having a first metal material and a second metal material different from the first metal material;
- a fixed abrasive polishing pad that includes a suspension medium having a planarizing surface for engaging the microelectronic substrate, the suspension medium including a plurality of abrasive elements distributed in the suspension medium proximate to the planarizing surface;
- and
- a planarizing liquid disposed on the planarizing surface to at least partially chemically remove at least one of the first metal material and the second metal material, the planarizing liquid and the abrasive elements together having a first removal rate of the first metal material when the planarizing surface is engaged with the microelectronic substrate and at least one of the microelectronic substrate and the suspension medium is moved relative to the other, and the planarizing liquid and the abrasive elements together having a second removal rate of the second metal material when the suspension medium body is engaged with the microelectronic substrate and at least one of the microelectronic substrate and the suspension medium is moved relative to the other, a ratio of the first removal rate to the second removal rate being less than or equal to approximately two.
Dependencies are inferred from the claim text.