BGA socket with improved contacts

An electrical socket for electrically interconnecting an integrated circuit (IC) module and a circuit board, comprising:

• a base defining a plurality of contact passageways;
• a cover movably mounted on the base and defining a plurality of receiving holes in alignment with the contact passageways for receiving corresponding pins of an IC module;
• and
• a plurality of contacts received in the contact passageways, each contact having a fitting portion engaged with the base, a contact portion formed above the fitting portion for engaging with a corresponding pin of the IC module, a contact pad formed below the fitting portion and extending perpendicularly from the fitting portion for being soldered to a printed circuit board, the contact pad having at least three bumps formed on a bottom surface thereof, and a solder ball soldered to the bottom surface and the at least three bumps of the contact pad;
• wherein
• the at least three bumps are formed around a center portion of the contact pad of each contact.